Customize Your PVD System | HEX Configurator by Korvus Technology

Sample Tables

Sample Stages

Versatile Sample Stages for Precision Control

Korvus Technology's sample stages are designed to enhance thin-film deposition processes by offering precise control over sample positioning, temperature, and movement. These stages are modular and easily interchangeable, allowing researchers to customize their setup for optimal film uniformity and morphology. Options include rotation (5–28 rpm), heating (up to 500 °C), RF and DC bias, water cooling (to 15 °C), and Peltier plate cooling (to -10 °C). This versatility ensures compatibility with various sample sizes and materials, facilitating a wide range of research applications.

Sample tables - Precision control

Rotation: Enhances film uniformity with adjustable speeds between 5 and 28 rpm.
Heating: Enables sample heating up to 500 °C for improved film morphology.
Cooling: Water cooling to 15°C and Peltier cooling to -10°C for sensitive samples
Biasing: RF and DC bias for pre-cleaning and modifying film properties.

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LoadLock

Loadlock

Versatile Load Locks for Precision Applications

Korvus Technology's load locks are engineered to enhance thin-film deposition processes by offering precise control over sample transfer, vacuum integrity, and contamination prevention. These load locks are modular and easily adaptable, allowing researchers to customize their setup for optimal throughput and system performance. Options include automated transfer mechanisms, high-vacuum compatibility, rapid pump-down times, and integration with existing deposition systems. This versatility ensures compatibility with various chamber configurations, facilitating a wide range of research and industrial applications.

Load locks - Precision control

Automated Transfer: Seamless sample movement while maintaining vacuum integrity.
Designed to achieve ultra-low base pressures for contamination-free environments.
Rapid Pump-Down: Enables fast cycle times, improving operational efficiency.
Customization: Compatible with multiple chamber designs and research requirements.

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HiPace Pumps

Pump 80L 300L 700L

Flexible Vacuum Solutions

Korvus Technology offers three pump sizes—HiPace 80, HiPace 300, and HiPace 700—tailored to meet diverse thin-film deposition requirements. These pumps provide varying levels of performance, from the compact 80 L/s model for smaller systems to the powerful 700 L/s option for ultra-high vacuum applications. With robust cooling options, flexible mounting configurations, and precise vacuum control, they are ideal for achieving clean and consistent deposition environments across a range of setups.

Pumps - Flexible Vacuum Solutions

HiPace 80: Compact and efficient, 80 L/s speed for smaller chambers.
HiPace 300: Mid-range option offering 300 L/s, balancing speed and versatility.
HiPace 700: High-performance pump with 685 L/s, suitable for ultra-high vacuum needs.
All pumps offer cooling and flexible mounting for easy integration.

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Deposition Sources

TES

Thermal Evaporation Source

The Korvus TES thermal boat sources allow quick removal of the sources to allow replenishment of the evaporant material. Boats and filaments can also be easily and rapidly replaced.The TES sources are available as a single-source per flange unit.Optionally, thermocouples may be mounted to monitor the boat temperature. Each source can be equipped with a manual or automatic shutter.Multiple sources may be accommodated in one system. The sources can also be used in conjunction with other techniques such as sputtering, e-beam deposition and low-temperature sources.

TES - Thermal Evaporation Source

Utilizes thermal boats with volumes ranging from 1 cc to 5 cc.
Suitable for high-temperature evaporation up to 2200°C (material dependent).
Relies on system thermal management for cooling.
Compatible with DC power supplies up to 1.2 kW for efficient operation.

Technical Specifications

Target Diameter

N/A

Target Thickness

N/A (non-magnetic)

N/A (magnetic)

Magnet Type

N/A

Power Supply Compatibility

DC,

Cooling

Thermal Management

Mounting

Flange-mounted

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Deposition Sources

TAU

E-Beam Evaporation

The TAU E-Beam evaporation source is a ‘mini’ source, meaning that it doesn’t use the beam-bending magnets found in other, larger electron beam evaporation sources. The TAU produces a high voltage at the target material while using the low voltage at the tungsten emission filament to produce a direct heating and evaporative effect. One of the most significant concerns with the e-beam evaporation process is the heat generated during the vaporisation stage.

TAU - E-Beam Evaporation

Accepts rods up to 4 mm diameter or 1 cc crucibles for material evaporation.
Uses electron beam technology for high-precision thin-film deposition.
Water-cooled design minimizes thermal load with a 0.5 l/min flow rate.
Compatible with high-voltage power supplies for e-beam applications.

Technical Specifications

Target Diameter

Accepts rods up to 4 mm or 1 cc

Target Thickness

N/A (non-magnetic)

N/A (magnetic)

Magnet Type

N/A

Power Supply Compatibility

DC,

Cooling

Water-cooled

Mounting

Flange-mounted

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Deposition Sources

QCM

Real-Time Thin-Film Monitoring

The Quartz Crystal Microbalance (QCM) is a precise tool for monitoring film thickness during deposition processes by measuring frequency shifts in a quartz crystal. It is highly sensitive, allowing sub-nanometer control and is compatible with a range of materials, including metals and dielectrics. The QCM integrates seamlessly with deposition systems, offering real-time feedback for enhanced accuracy and uniformity.

QCM - Real-Time Thin-Film Monitoring

Monitors thin-film deposition in real-time via quartz crystal frequency shifts.
Offers sub-nanometer precision, ideal for high-accuracy applications.
Works with various deposition systems, including sputtering and evaporation.
Ensures uniform film growth and process repeatability for enhanced reliability.

Technical Specifications

Target Diameter

N/A

Target Thickness

Measures film thickness down to sub-nanometer precision.

Magnet Type

N/A

Power Supply Compatibility

DC,

Cooling

N/A

Mounting

Flange-mounted

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Deposition Sources

ORCA

Low-Temperature Evaporation

The ORCA organic deposition source is designed to operate between 50 and 600 C to allow sensitive organic materials to be evaporated with precise control. This source can also be used to evaporate low-temperature metals such as Lithium, and pairs well with the glovebox integration of the HEX Series.

ORCA - Low Temperature Evaportation

Designed for precise evaporation of organic materials and low-temperature metals.
Equipped with a 15 cc crucible (optional 5 cc) and K-type thermocouple for accuracy.
Active water cooling ensures temperature stability with 0.5 l/min flow rate.
Compatible with DC power supplies for seamless integration.

Technical Specifications

Target Diameter

N/A

Target Thickness

N/A

Magnet Type

N/A

Power Supply Compatibility

DC,

Cooling

Water-cooled

Mounting

Quick release

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Deposition Sources

FISSION

Magnetron Sputtering Source

Designed for 2", 3" and 4" diameter targets, the sputter sources are equipped with SmCo magnets and accept targets with thickness ranging from 0.5 to 6mm of non-magnetic materials and up to 1mm for magnetic materials. The most flexible source, the FISSION can be paired with DC, RF, HiPIMS, Pulsed-DC and more...

FISSION - Magnetron Sputtering