New Developments of the HEX Series- HEX-L Dual Cluster, HEX-XL and Custom Third-Party Systems

Korvus Technology manufactures highly modular thin film deposition systems. The company’s HEX series offers an unmatched level of user control and customization, designed to incorporate the latest thin film technologies and performance into single chamber and cluster systems.

The HEX Series’ modularity facilitates fast-moving research and development- this webinar will be outlining the core features of the HEX Series as well as exploring new developments which have been thought out, tested and finally built over the past few months.

This webinar will be of interest to PVD users, potential customers and existing customers, because all future upgrades can easily be fitted to existing HEX systems, no matter how old. 

This webinar will focus on the following key topics:

3 and 4 inch diameter magnetron sputtering sources

Larger “HEX-XL” system capable of fitting up to 12″ diameter wafers

The new HEX-L Dual Cluster with a loading arm for in-vacuum transfer between the two chambers

Stacked HEX Series, and its use in lift-off deposition

New “Mini HEX” Coater

Custom systems which have been built using third-party components, such as Telemark High Power Ebeams, Langmuir Probes, Nanoparticle Sources and Ion Gun Etchers