The HEX Series

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THE HEX SERIES

The open frame design of our systems is the bedrock upon which the flexibility of the HEX series is built. No matter what your application, or where your research may go, the HEX series can be easily adjusted or reconfigured to suit.

HEX

Benchtop or rack-mounted compact system

  • Maximum Sample Size Diameter: 4" (100mm)
  • Deposition Sources: Up to 3
  • Magnetron Sputter Size (Diameter) 2"
  • Chamber Volume 122 L - (24 L When Stacked)
  • Base Pressure = 5×10-7 mbar*

*Ultimate base pressure is on factory tested systems. Subsequent base pressure depends on a variety of factors such as chamber cleanliness, user operation and lab environment.

HEX L

Mobile base-stand-mounted system

  • Maximum Sample Size Diameter: 6" (150mm)
  • Deposition Sources: Up to 6
  • Magnetron Sputter Size (Diameter) 2" or 3"
  • Chamber Volume 50L - (100L When Stacked)
  • Base Pressure = <5×10-7 mbar*
Hex PVD System

*Ultimate base pressure is on factory tested systems. Subsequent base pressure depends on a variety of factors such as chamber cleanliness, user operation and lab environment.

HEX XL

Benchtop or rack-mounted compact system

  • Maximum Sample Size Diameter: 12" (300mm)
  • Deposition Sources: Up to 6
  • Magnetron Sputter Size (Diameter) 3" - 4"
  • Chamber Volume 86 L - (172 L When Stacked)
  • Base Pressure = 5×10-7 mbar*

*Ultimate base pressure is on factory tested systems. Subsequent base pressure depends on a variety of factors such as chamber cleanliness, user operation and lab environment.

THE HEX SERIES

FUTURE-PROOF
complete flexibility in your process

The HEX series offers complete flexibility in your process. Whether you need the standard, L or XL, all systems are future-proof.

Upgrade or Modify with Ease. Add sources at any point in the systems life without needing engineer visits or downtime

Stack it. Stack your HEX at any point in its life to optimise process parameters when longer throw distance is needed.

Sputter up or Sputter Down. Switching the detachable top or bottom plates allows either configuration, with sputter up useful for evaporative methods, while sputter down eliminates shadowing on heavier samples.

Source to Substrate Distance and Angle. Utilise the HEX series’ modularity to change source-sample distance and angle at will. This gives users complete control over their process parameters, useful for optimising uniformity, deposition angle and thermal load on the substrate.

Magnetron Sputtering Scource

FISSION- Magnetron Sputtering Source

Designed for 2″, 3″ and 4″ diameter targets, the sputter sources are equipped with SmCo magnets and accept targets with thickness ranging from 0.5 to 6mm of non-magnetic materials and up to 1mm for magnetic materials. The most flexible source, the FISSION can be paired with DC, RF, HiPIMS, Pulsed-DC and more…
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low temperature evaporation

ORCA - Low Temperature Evaporation

The ORCA organic deposition source is designed to operate between 50 and 600 C to allow sensitive organic materials to be evaporated with precise control. This source can also be used to evaporate low-temperature metals such as Lithium, and pairs well with the glovebox integration of the HEX Series.
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electron beam evaporation

TAU - Electron Beam Evaporation

Our high-accuracy (sub-monolayer) mini E-beam evaporators are ideal for ultra-thin film deposition of high-temperature metals with reliable process control. Material can be evaporated from rods or material held in a crucible. Our novel design allows the material to be co-deposited from four individual pockets.
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thermal boat evaporation

TES - Thermal Boat Evaporation

The single thermal boat source from Kovus Technology allows for the integration of a range of thermal boats for the deposition of metals. This allows for an extremely inexpensive, very robust and effective source, the TES is also ideal for those who want to thermally evaporate standard metals.
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Frequently Asked Questions

Thin film deposition refers to any technique where a very thin film of material, usually only a few atoms thick, covers a particular substrate. What makes this process attractive is the versatility and range of both the coating and target material, which allows the coating to improve or alter the substrate’s performance. Common applications include making the substrate scratch-resistant, making it more or less electrically conductive, or improving on a substrate’s durability.

The two primary methods of thin film deposition systems rely on either a physical evaporation process or chemical reactions to atomise the source material before bonding it to the substrate layer by layer. Physical processes rely on very low pressures on a resistive heat source to produce the required vapour pressure, while chemical processes use reactive gas and another precursor gas. When the two gases interact on the substrate, a chemical reaction occurs that results in an even film without the need for spin coating methods that may influence thickness or purity.

Read more about thin film deposition

A PVD system is a machine designed to create thin-film coatings on a variety of materials. Operating within a vacuum chamber, it vaporises solid materials and deposits them, atom by atom, onto a substrate. This precise deposition process produces highly durable coatings, with meticulous control over thickness and composition.

The PVD process involves several stages: evaporation, transportation, condensation and bonding. There are many methods of PVD coating with their own use cases that you can read about on our website. Thermal evaporation, for example, uses high temperatures to vaporise the target material. Alternatively, sputtering employs ionised gas to bombard a target, dislodging atoms for deposition. Thermal evaporation offers higher throughput, while sputtering provides exceptional uniformity and minimal impurity levels.

PVD systems are capable of coating a wide range of materials, including metals and nitrides. They are widely used in industries requiring robust and durable coatings for applications in the medical, aerospace and solar industries. The vacuum environment ensures purity and strong adhesion, resulting in long-lasting, high-performance coatings.

Creating thin films with PVD coating allows manufacturers to change or enhance the properties of the substrate. The evaporated material is deposited onto the substrate in a controlled process, providing additional durability or conferring new properties such as conductivity.

PVD systems provide precise and durable coatings for a wide range of applications. PVD is used due to the coatings’ adhesion, durability and resistance to wear.

Advantages include:

  • Versatility: Coatings can be vaporised in a vacuum and deposited atom by atom, allowing for precise multilayer films.
  • Efficient processes: The techniques ensure uniform coatings by precisely controlling the deposition of atoms or molecules, reducing waste and enhancing efficiency, even for complex substrates.
  • Enhanced properties: The use of oxygen and other reactive gases enables compound materials (e.g., titanium nitride) for corrosion resistance and reduced friction.
  • Environmentally friendly: PVD produces functional and protective coatings with no toxic residues.

Many bench-top thin film deposition systems are solid-state instruments that offer limited functionality. The HEX series is unique amongst thin film deposition systems due to its versatility — its modular design allows for customisation and robust user control features. Not only does this make the HEX ideal for teaching about various thin film techniques, but it also allows research and production facilities to incorporate the latest advancements in thin films into their bench-top system.

Please contact us at Korvus Technology or download our brochure here for more information.